SMT Assembly Procedure and Its Development Trend

SMT Assembly Procedure and Its Development Trend

This article introduces the SMT (Surface Mount Technology) assembly procedure and its development trend for the future.

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SMT Assembly Procedure

Rework is carried out to fix or remanufacture PCBs that have defects identified through inspection. This requires equipment and tools such as electric soldering irons and rework stations. Rework can be performed at any position in the SMT assembly line.

Inspection is done during the SMT assembly procedure to ensure that the quality of soldering and assembly meets manufacturing standards and regulations. Various equipment and tools, such as magnifying lenses, microscopes, ICT (In-circuit Testers), flying probe tests, AOI (Automated Optical Inspection), X-ray inspections, and function testers, can be used. Inspection equipment can be placed in any suitable position as required.

Cleaning aims to remove hazardous residues left on the board, often from flux used during the reflow soldering process. Cleaning machines, which are not fixed in one position, are used for this purpose and can be utilized during or after the SMT assembly line.

During reflow soldering, solder paste is melted to affix SMCs (Surface Mount Components) or SMDs (Surface Mount Devices) to the PCB. This is done in a reflow soldering oven located after the chip mounter in the SMT assembly line.

Chip mounting involves placing components onto their designated positions on the PCB according to design files. This step is performed by a chip mounter, which is situated after the solder paste printer in the SMT assembly line.

Solder paste printing involves placing solder paste onto the PCB pads through a stencil. This step is carried out by a solder paste printer, located at the beginning of the SMT assembly line.

The main steps in the SMT assembly procedure include solder paste printing, chip mounting, reflow soldering, cleaning, inspection, and rework, as detailed above.

SMT Development Trend in the Future

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Development Trend #1: Quick, Flexible, and Fast-Responsive

The future of SMT will be highly competitive, necessitating swift, adaptable, and fast-responsive technical equipment. Achieving this will provide more market opportunities and profitability. Hence, SMT machinery will evolve to be quicker, more flexible, and more responsive.

SMT assembly lines have grown from single machines to multiple equipment lines, improving volume production. Achieving high efficiency is crucial, indicated by productivity and control efficiency. Higher productivity stems from proper allocation. Additionally, efficient SMT lines have evolved from single-line to double-line manufacturing, reducing the area covered and increasing manufacturing rates.

Development Trend #2: Green and Environment-Friendly

It is well-known that SMT assembly lines have caused environmental harm, from materials like packaging, solder paste, adhesives, and fluxes. As SMT lines increase and improve, so does the environmental damage. Future SMT assembly lines will therefore focus on being green and eco-friendly.

Green manufacturing means meeting environmental protection requirements from the start of SMT assembly. Potential pollution sources and their severity should be carefully analyzed for each SMT procedure. This ensures appropriate equipment, materials, regulations, and conditions are chosen. Consequently, both manufacturing scale and capacity must consider environmental impacts to align with protection demands.

Development Trend #3: High-Efficiency and Intelligent

The future of SMT equipment indicates the level of SMT assembly. Manufacturing efficiency will become a key performance standard. To enhance this, adjustments to equipment structure and performance improvements are necessary.

Another trend is equipment flexibility, enabling users to customize services based on their specific demands. Modularization can cater to different functions, meeting mounting demands from various components. This approach ensures high accuracy and speed, thereby increasing overall manufacturing efficiency.

SMT, as a modern electronics assembly technology, has spread across numerous fields. Due to its benefits, SMT has partly or entirely replaced traditional assembly techniques, bringing major changes to the electronics industry. Therefore, understanding SMT assembly procedures and future trends is imperative for serving industries better.

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