How to Choose Backing Plates for Sputtering Targets?

Sputtering is one of the main techniques for preparing thin film materials. It uses ions generated by ion sources to accelerate and aggregate in a vacuum to form high-speed energy ion beams, bombard the solid surface, and exchange kinetic energy between ions and solid surface atoms.

The atoms on the solid surface leave the solid and deposit on the surface of the substrate, and the bombarded solid material is called a sputtering target.

The backing plate is a key component in the sputtering process, providing support for the sputtering target and fixing it to the sputtering apparatus. In addition, the back plate also functions to dissipate heat generated during sputtering.

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How to choose the raw material for the Backing plate?

The most common backing plate materials are Copper and Stainless Steel. The properties of these materials make them ideal for sputtering target applications. When selecting a backing plate material, it is important to consider compatibility with the sputtering target material.

Copper(oxygen-free copper):

Because it has good electrical and thermal conductivity and is easy to process. If properly maintained, the oxygen-free copper backplane can be reused more than ten times.

Stainless Steel:

Currently, stainless steel tubes are most commonly used as back tubes for rotating targets. Stainless steel pipes have good strength and thermal conductivity and are very economical.
There are a few other materials that are sometimes used for backing plates, but they are less common. These include molybdenum, tungsten, and graphite.

Molybdenum:

It has a high melting point and is resistant to corrosion, making it a good choice for high-temperature applications.

Tungsten:

Tungsten is also resistant to corrosion and has a high melting point, but it is much heavier than other backing plate materials. Graphite is lightweight and has good thermal conductivity, but it can be difficult to work with.

If you have any questions about backing plate materials, or if you need help selecting the right material for your application, please contact us. We would be happy to help you choose the best material for your needs.
 

Important Factors to Consider

When choosing a backing plate for a sputtering target, there are several important factors to consider.

1, The backing plate must adhere well to the target, while also providing good electrical contact.

2, make sure that the backing plate has good thermal conductivity so that it can dissipate the heat generated by sputtering. It should be able to cool the target and target assembly effectively.

3, In addition, consider the mechanical strength of the backing plate. The backing plate needs to be strong enough to support the weight of the target and withstand the stresses of sputtering.

Keep in mind that sputtering targets are only effective when they're used correctly.
If you follow these above tips, your target will be able to deliver optimal results for any application!
 

Our Backing Plates

At AEM Deposition, we understand that sputtering is a critical part of many manufacturing processes. That's why we offer a wide range of sputtering targets and OEM services to meet your specific needs. Our backing plates are available in a variety of materials and sizes and can be purchased individually or in combination with our sputtering targets. 

Are you interested in learning more about rotary sputter target? Contact us today to secure an expert consultation!

With our combination of products and outstanding OEM services, we're confident that we can provide you with the lowest total cost of ownership for your sputtering process.

So if you're looking for the best products and services at the most competitive prices, look no further than AEM Deposition Company. We're confident that we can exceed your expectations.Contact us today to learn more about how we can help you streamline your manufacturing process.

I have been asked to explain why someone would want to use rotary sputtering targets instead of planar sputtering targets.

Certainly there is some expense involved with larger targets and new equipment (assuming you are currently using a planar system), but in a high volume process (such as roll-to-roll thin film deposition) the advantages lead to a lower cost of ownership:

• Compared to planar targets, rotary targets generally have more surface area per given length.

• Rotary targets have much more surface area, so the magnetron power can be spread out over a larger area in a given amount of time. This helps keep the target running cooler, decreases nodule formation, and reduces the occurrence of arcing.

1. Since rotary sputtering decreases nodule formation, targets can have longer continuous runtimes.
2. There is generally more material available to sputter on a rotary target, which increases runtimes.
3. Rotary target utilization is usually ~80%, as opposed to ~30% for planar targets &#; which decreases scrap and increases runtimes.

• Rotary targets are well suited for continuous sputtering processes. Continuous processing increases throughput since there is less time wasted preparing the sputtering chamber.

• Rotary targets are more cost effective for high volume processes. They provide a good platform for long runtime processes, with less chance of defects and downtime.

• Planar targets are still best suited for prototype work or elemental experimentation, especially when large amounts of material are not needed at once.

If you are interested in discussing sputtering targets, contact our team at:

~Jim

Authored by previous Indium Application Manager Jim Hisert