1) BGA (Ball Grid Array)
If you want to learn more, please visit our website Standard Smd Package Sizes.
BGA is one of the surface mount packages, and it has an array of spherical contacts. Spherical bumps are made on the back of the printed circuit board in a display mode to replace the pins. The LSI chip is assembled on the front side of the printed circuit board and then sealed by molding resin or potting. Pins can exceed 200, which is for a multi-pin LSI package.
The package body can also be made smaller than QFP(Quad Flat Package). For example, with a pin center distance of 1.5mm, a 360- pin BGA is only 31 square millimeters. On the other hand, with a pin center distance of 0.5mm, a 304-pin QFP is 40 square millimeters. Moreover, BGA does not have to worry about QFP pin deformation issues.
Motorola Corporation of the United States developed this package. It was first adopted in portable phones and other devices and may be popularized in personal computers in the United States in the future. Initially, the BGA pin (bump) center distance was 1.5mm, and the total number of pins was 225. There are also some LSI manufacturers that are developing 500-pin BGAs.
The problem with BGA is the visual inspection after reflow soldering. It is not yet clear whether an effective visual inspection method is available. Some believe that due to the large center distance of welding, the connection can be regarded as stable and can only be processed through functional inspection.
American Motorola Company calls the package sealed with molded resin as OMPAC, and the package sealed with potting method is called GPAC (see OMPAC and GPAC).
2) BQFP (Bumpered Quad Flat Package)
It is one of the QFP packages with protrusions (buffer pads) that are provided at the four corners of the package body to prevent bending and deformation of the pins during transportation. American semiconductor manufacturers mainly use this package in ASICs such as microprocessors and circuits. The pin center distance is about 0.635mm, and the pin number ranges from 84 to 196. (see QFP).
3) Butt Welding PGA(Butt Joint Pin Grid Array)
It is another name for Surface mount BGA (see surface mount BGA).
4) C-(ceramic)
It indicates the mark of the ceramic package. For example, CDIP stands for ceramic DIP. It is a mark that is often used in practice.
5) Cerdip
Ceramic dual in-line package, sealed with glass, is used for ECL RAM, DSP (digital signal processor), and other circuits. With glass windows, Cerdip is used for ultraviolet erasable EPROM. The pin center distance is 2.54mm, and the number of pins is from 8 to 42. In Japan, this package is expressed as DIP-G (G means glass seal).
6) Cerquad
It is one of the surface mount packages. The ceramic sealed QFP is used for packaging DSP logic under the seal, such as LSI circuits. With windows, Cerquad is used to encapsulate EPROM circuits. The heat dissipation is better than that of plastic QFP, and it can tolerate under natural air-cooling conditions of 1.5 to 2W of power. However, packaging costs three to five times higher than plastic QFP. The center distance between pins has a variety of specifications, such as 1.27mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, and so on. The number of pins ranges from 32 to 368.
7) CLCC (Ceramic Leaded Chip Carrier)
It is one of the surface mount packages that is a ceramic chip carrier with pins. The pins are drawn from the four sides of the package and are in a T-shape. With windows, it is used to package ultraviolet erasable EPROM and EEPROM microcomputer circuits. This package is also called QFJ, QFJ-G (see QFJ).
8) COB (Chip on Board)
Chip packaging is one of the bare chip mounting technologies. The semiconductor chip is handed over and mounted on the printed circuit board. The electrical connection between the chip and the substrate is made by wire stitching. The electrical connection between the chip and the substrate is covered with resin to ensure reliability. Although COB is the simplest bare chip mounting technology, its packaging density is far inferior to TAB and flip-chip bonding technology.
9) DFP (Dual Flat Package)
Dual Flat Package is another name for SOP (see SOP). This term was common, but it is not used now.
10) DIC (Dual in-line Ceramic Package)
It is another name for ceramic DIP (including glass seal) (see DIP).
11) DIL (Dual in-line)
It is another name for DIP (see DIP). European semiconductor manufacturers often use this name.
12) DIP (dual in-line package)
Dual in-line Package is one of the plug-in packages. The pins are drawn from both sides of the package, and the package materials are plastic and ceramic.
DIP is the most popular plug-in package, and its application range includes standard logic ICs, memory LSIs, and microcomputer circuits. The pin center distance is 2.54mm, and the number of pins is from 6 to 64. The package width is usually 15.2mm. Some packages with a width of 7.52mm and 10.16mm are called skinny DIP and slim DIP (narrow DIP), respectively. But in most cases, no distinction is made, and they are simply collectively referred to as DIP. In addition, ceramic DIP sealed with low-melting glass is also called Cerdip (see Cerdip).
13) DSO (Dual Small Out-line)
Dual Small Out-line package is another name for SOP (see SOP). Some semiconductor manufacturers use this name.
14) DICP (Dual Tape Carrier Package)
Dual Tape Carrier Package is one of TCP (carrying package). The pins are made on the insulating tape and lead out from both sides of the package. Due to the use of TAB (Automatic On-Load Soldering) technology, the package outline is very thin. It is often used in LCD driver LSI, but most of them are customized products. In addition, the 0.5mm thick memory LSI book package is in the development stage. In Japan, in accordance with the EIAJ (Electronic Industries Association of Japan) standards, DICP is named DTP.
15) DTP (Dual Tape Carrier Package)
It is the same as above DICP. The Electronic Industries Association of Japan names it DTP.
16) FP (Flat Package)
Flat Package is one of the surface mount packages. It is another name for QFP or SOP (see QFP and SOP). Some semiconductor manufacturers use this name.
17) Chip
Flip-chip welding is one of the bare chip packaging technologies to make metal bumps in the electrode area of &#;&#;the LSI chip and then connect the metal bumps with the electrode area on the printed circuit board.
The footprint of the package is basically the same as the chip size. It is the smallest and thinnest of all packaging technologies. However, if the thermal expansion coefficient of the substrate is different from that of the LSI chip, a reaction will occur at the joint, which will affect the reliability of the connection. Therefore, it is necessary to use resin to reinforce the LSI chip and use a substrate material with substantially the same thermal expansion coefficient.
18) FQFP (Fine Pitch Quad Flat Package)
FQFP usually refers to the QFP with a lead center distance less than 0.65mm (see QFP). Some conductor manufacturers use this name.
19) CPAC (Globe Top Pad Array Carrier)
American Motorola Company&#;s nickname for BGA (see BGA).
20) CQFP (Quad Flat Package with Guard Ring)
It is a four-side pin flat package with a guard ring. It is one of the plastic QFPs in which the pins are masked with a resin protection ring to prevent bending and deformation. Before assembling the LSI on the printed circuit board, cut the lead from the guard ring and make it into a seagull wing shape (L shape). This kind of package has been mass-produced by Motorola Company in the United States. The pin center distance is 0.5mm, and the number of pins is about 208 at most.
21) H- (With Heat Sink)
It means a radiator. For example, HSOP means SOP with a heat sink.
22) Pin Grid Array (Surface Mount Type)
Usually, PGA is a plug-in package with a pin length of about 3.4mm. The surface mount PGA has display-like pins on the bottom surface of the package, and its length ranges from 1.5mm to 2.0mm. Mounting uses the method of butt welding with the printed circuit board, so it is also called butt welding PGA. Because the pin center distance is only 1.27mm, which is half smaller than the plug-in type PGA, the package body cannot be made so large. The number of pins is more than that of the plug-in type (250&#;528), which is a package for large-scale logic LSIs. The encapsulated substrates include multilayer ceramic substrates and glass epoxy resin printing bases. The packaging of multilayer ceramic substrates has been put into practical use.
23) JLCC (J-leaded chip carrier) J-leaded Chip Carrier
It is another name for CLCC with window and ceramic QFJ with window (see CLCC and QFJ). Some semiconductor manufacturers adopted the name.
24) LCC (Leadless Chip Carrier)
Leadless Chip Carrier refers to a surface-mount package in which the four sides of the ceramic substrate are only in contact with electrodes without leads. It is an IC package for high-speed and high-frequency, also called ceramic QFN or QFN-C (see QFN).
25) LGA (Land Grid Array)
Contact Display Package is a package with array state electrode contacts that are made on the bottom surface. Just plug in the socket when assembling. There are now practical ceramic LGAs with 227 contacts (1.27mm center distance) and 447 contacts (2.54mm center distance), which are used in high-speed logic LSI circuits.
Compared with QFP, LGA can accommodate more input and output pins in a smaller package. In addition, since the impedance of the lead is small, it is very suitable for high-speed LSI. However, due to the complicated production and high cost of sockets, they are basically not used much now. It is expected that its demand will increase in the future.
26) LOC (Lead on Chip)
Chip Lead Package is one of the LSI packaging technologies. It has a structure in which the front end of the lead frame is above the chip, bump solder joints are made near the center of the chip, and wire stitching is used for electrical connection. Compared with the original structure in which the lead frame is arranged near the side of the chip, the chip is contained in the same size package and has a width of about 1 mm.
27) LQFP (Low Profile Quad Flat Package)
Thin QFP refers to the QFP with a package body thickness of 1.4mm. It is the name used by the Japanese Electronic Machinery Industry according to the new form factor formulated QFP.
28) One of L-QUAD
Aluminum nitride is used for packaging substrates that have a thermal conductivity 7-8 times higher than aluminum oxide and have better heat dissipation. The frame of the package is aluminum oxide, and the chip is sealed by potting, thereby suppressing the cost. It is a package developed for logic LSI, which can tolerate W3 power under natural air-cooling conditions. 208-pin (0.5mm center distance) and 160-pin (0.65mm center distance) LSI logic packages have been developed, and mass production began in October .
29) MCM (multi module)
It is a package in which multiple semiconductor bare chips are assembled on a wiring substrate. According to the substrate material, it can be divided into three categories: MCM-L, MCM-C, and MCM-D.
MCM-L is a component using a common glass epoxy multilayer printed circuit board. The wiring density is not very high, and the cost is low. MCM-C uses thick film technology to form multilayer wiring and uses ceramic (alumina or glass-ceramic) as a substrate component, which is similar to a thick film hybrid IC using a multilayer ceramic substrate. There is no obvious difference between the two. The wiring density is higher than MCM-L. MCM-D uses thin-film technology to form multilayer wiring, with ceramic (aluminum oxide or aluminum nitride) of Si or Al as the substrate component. The wiring scheme is the highest among the three components, but the cost is also high.
30) MFP ( Mini Flat Package)
It is another name for plastic SOP or SSOP (see SOP and SSOP). It is the name adopted by some semiconductor manufacturers.
By VCT Technology /11/30
Are you new to the world of SMD component packages and feeling overwhelmed by the different types available? Look no further! In this comprehensive guide, we will help you navigate through the various SMD component packages, demystifying their differences and functionalities.
From to QFN to BGA, SMD component packages come in a wide range of shapes and sizes, each serving a specific purpose in the electronics industry. Whether you are an electronics enthusiast, hobbyist, or professional, understanding these different packages is essential for successful circuit board design and assembly.
In this article, we will explore the various types of SMD component packages, discussing their features, advantages, and applications. We will delve into the world of chip resistors, capacitors, diodes, transistors, and more, providing you with an in-depth understanding of how these components are packaged and what factors to consider when selecting the right package for your project.
So, if you're ready to enhance your knowledge of SMD component packages, strap in and let's dive into this comprehensive guide!
Overview of through-hole vs. surface mount technology
Are you interested in learning more about Standard Smd Sizes? Contact us today to secure an expert consultation!
Explore more:Is A Single Ram BOP Enough?Ultimate Guide to High-Speed Dried Fruit Packing Machine - All Your Questions Answered!What are the factors affecting feed mixing?What are the top 10 factors to consider before purchasing an oil refinery machine?What are the benefits of EPE foam?When was ozone first used in water treatment?How do I choose a measurement tool?
SMD component packages are an integral part of the surface mount technology (SMT) used in modern electronic devices. Before we explore the different types of SMD component packages, it's important to understand the difference between through-hole and surface mount technology.
Traditionally, electronic components were mounted using through-hole technology, where leads were inserted into holes on the circuit board and soldered on the opposite side. While through-hole technology is still used in certain applications, surface mount technology has become the standard for most modern electronic devices.
Surface mount technology involves directly mounting components onto the surface of the circuit board, eliminating the need for holes and allowing for smaller, more compact designs. SMD component packages are specifically designed for surface mount technology, making them the go-to choice for most electronic designs today.
The shift from through-hole to surface mount technology has revolutionized the electronics industry, enabling the production of smaller, lighter, and more efficient devices. Now, let's explore the different types of SMD component packages and their specific characteristics.
Common types of SMD component packages
Small Outline Integrated Circuit (SOIC) packages
The Small Outline Integrated Circuit (SOIC) is one of the most commonly used SMD component packages. It features a rectangular shape with leads on two sides, making it easy to solder onto the circuit board. SOIC packages are available in different sizes, with the number of leads ranging from 8 to 32.
SOIC packages are widely used for various integrated circuits, including microcontrollers, operational amplifiers, and memory chips. They offer a good balance between size and ease of assembly, making them suitable for a wide range of applications.
One of the key advantages of SOIC packages is their compatibility with automated manufacturing processes. Their standardized dimensions and easily visible leads allow for efficient pick-and-place assembly, reducing production time and cost. Additionally, SOIC packages offer good thermal performance and can handle moderate power dissipation.
Quad Flat Package (QFP) packages
The Quad Flat Package (QFP) is another popular SMD component package, commonly used for integrated circuits with a higher pin count. QFP packages feature leads on all four sides of the package, providing a large number of connection points.
QFP packages come in various sizes, ranging from 32 to over 300 leads. The leads are typically in the form of thin metal strips, making them suitable for fine-pitch applications where space is limited. QFP packages are commonly used for microprocessors, DSPs, and other high-performance ICs.
One of the key advantages of QFP packages is their high pin density, allowing for more functionality in a smaller footprint. They also offer good thermal and electrical performance, making them suitable for applications that require high-speed data processing.
Ball Grid Array (BGA) packages
Ball Grid Array (BGA) packages are widely used for integrated circuits that require high pin density and enhanced thermal performance. Unlike other SMD component packages, BGA packages have solder balls on the bottom surface instead of leads.
The solder balls on BGA packages are arranged in a grid pattern, hence the name "Ball Grid Array." The package is mounted onto the circuit board by aligning the solder balls with corresponding pads on the board and reflow soldering them. BGA packages offer a large number of connection points, allowing for high pin count ICs.
BGA packages are commonly used for microprocessors, memory chips, and other high-performance ICs that require excellent thermal dissipation. The absence of leads also means reduced inductance and improved signal integrity, making BGA packages suitable for high-frequency applications.
Chip Scale Package (CSP) packages
Chip Scale Package (CSP) is a relatively newer type of SMD component package that has gained popularity in recent years. As the name suggests, CSP packages are designed to be as small as possible, with dimensions similar to the size of the integrated circuit itself.
CSP packages feature solder balls or solder bumps on the bottom surface, similar to BGA packages. However, the main difference is that CSP packages are typically smaller and have a higher pin count in relation to their size. CSP packages are commonly used for mobile devices, wearable technology, and other applications where size and weight are critical.
One of the key advantages of CSP packages is their smaller footprint, allowing for more compact designs and increased functionality. They also offer good thermal performance and electrical reliability, making them suitable for high-density applications.
Small Outline Integrated Circuit (SOIC) packages
Now that we have explored the common types of SMD component packages, let's compare their key characteristics and applications:
- Package Size: SOIC packages are available in a range of sizes, while QFP packages offer a higher pin count in a smaller footprint. BGA packages have a large number of solder balls, allowing for high pin density, and CSP packages are the smallest in terms of size.
- Assembly: SOIC packages are easily assembled using pick-and-place machines, while QFP packages require more precise alignment due to their fine-pitch nature. BGA packages require reflow soldering and careful placement of the solder balls, and CSP packages require specialized assembly techniques due to their small size.
- Thermal Performance: SOIC packages offer good thermal performance, suitable for moderate power dissipation. QFP packages have good thermal characteristics and can handle higher power dissipation. BGA packages excel in thermal dissipation due to their solder ball arrangement. CSP packages have good thermal performance despite their small size.
- Applications: SOIC packages are suitable for a wide range of integrated circuits, including microcontrollers and memory chips. QFP packages are commonly used for high-performance ICs, such as microprocessors and DSPs. BGA packages are ideal for high pin count and high-speed applications. CSP packages are used in compact devices where size and weight are critical.
Quad Flat Package (QFP) packages
When selecting an SMD component package for your project, there are several factors to consider:
- Functionality: Determine the required pin count and package size based on the functionality of the integrated circuit.
- Space Constraints: Consider the available space on the circuit board and choose a package that fits within the desired footprint.
- Thermal Requirements: Assess the power dissipation requirements of the IC and select a package with appropriate thermal characteristics.
- Assembly Process: Take into account the manufacturing process and choose a package that is compatible with the assembly equipment and techniques.
- Cost: Consider the cost of the package and its impact on the overall project budget.
By carefully evaluating these factors, you can choose the most suitable SMD component package for your project, ensuring optimal performance and reliability.
Ball Grid Array (BGA) packages
In this comprehensive guide, we have explored the different types of SMD component packages, including SOIC, QFP, BGA, and CSP. We have discussed their features, advantages, and applications, providing you with a deeper understanding of how these packages are used in the electronics industry.
When it comes to selecting the right SMD component package, it's important to consider factors such as package size, assembly process, thermal performance, and cost. By taking a holistic approach and evaluating these factors, you can make an informed decision that meets the requirements of your project.
Remember, each SMD component package has its own unique characteristics and benefits. Choose the package that best suits your specific needs and enhances the overall functionality of your electronic design.
So, whether you're building a complex circuit board or working on a small-scale project, the knowledge gained from this guide will be invaluable in your journey towards successful circuit board design and assembly. Happy packaging!
Chip Scale Package (CSP) packages
Ball Grid Array (BGA) packages have become increasingly popular in recent years due to their high pin density and improved thermal performance. These packages consist of an array of solder balls on the bottom side, which serve as electrical and mechanical connections to the PCB.
BGA packages offer several advantages over traditional packages. Firstly, they provide a larger number of I/O pins, allowing for more complex circuit designs. Secondly, the solder balls underneath the package provide better thermal conductivity, reducing the risk of overheating. Lastly, BGA packages are more resistant to mechanical stress and offer improved electrical performance.
There are different types of BGA packages, including plastic BGA (PBGA) and ceramic BGA (CBGA). PBGA packages are more cost-effective and suitable for most applications, while CBGA packages are more expensive but offer better thermal conductivity and reliability.
In terms of applications, BGA packages are commonly used in microprocessors, graphics cards, and other high-performance electronic devices. Their compact size and high pin density make them ideal for devices where space is at a premium.
Comparison of different SMD component packages
Chip Scale Package (CSP) packages are another type of SMD component package that has gained popularity in recent years. As the name suggests, CSP packages are designed to have the same dimensions as the integrated circuit (IC) chip itself, resulting in a smaller footprint and improved electrical performance.
CSP packages offer several advantages over traditional packages. Firstly, their smaller size allows for higher component density on the PCB, enabling miniaturization of electronic devices. Secondly, CSP packages have shorter electrical paths, reducing signal propagation delays and improving overall performance. Lastly, CSP packages are more resistant to thermal stress, making them suitable for high-temperature applications.
There are different types of CSP packages, including flip-chip CSP (FC-CSP) and molded CSP (M-CSP). FC-CSP packages have the IC chip directly mounted on the PCB using solder bumps, while M-CSP packages have the IC chip encapsulated in a mold compound.
CSP packages are commonly used in mobile phones, tablets, wearables, and other portable electronic devices. Their small size and high performance make them ideal for applications where space and power consumption are critical factors.
Factors to consider when choosing an SMD component package
When it comes to selecting the right SMD component package for your project, it's important to consider various factors such as size, pin count, thermal performance, and cost. To help you make an informed decision, let's compare some of the popular SMD component packages:
1. Size: SMD component packages come in different sizes, ranging from the smallest to larger packages like QFN and BGA. The choice of package size depends on the space available on the PCB and the desired component density.
2. Pin Count: The number of pins on a package determines the connectivity options for the component. Packages with higher pin counts offer more I/O options but may require more space on the PCB.
3. Thermal Performance: Some packages, such as BGA and CSP, offer better thermal performance due to their improved heat dissipation capabilities. This is crucial for components that generate a lot of heat during operation.
4. Cost: The cost of SMD component packages can vary significantly depending on factors such as package size, material, and manufacturing process. It's important to consider the budget constraints of your project when selecting a package.
By considering these factors and understanding the advantages and disadvantages of different SMD component packages, you can choose the package that best suits your project requirements.
Conclusion and final thoughts
Choosing the right SMD component package can have a significant impact on the success of your project. Here are some key factors to consider when making your decision:
1. Application: Consider the specific application of your project and the requirements of the components. For example, if you're designing a high-performance device, packages with better thermal performance, such as BGA and CSP, would be more suitable.
2. Space Constraints: Evaluate the available space on the PCB and select a package that fits within those constraints. Smaller packages like and CSP can help you achieve higher component density and miniaturization.
3. Manufacturability: Consider the ease of manufacturing and assembly when selecting a package. Some packages may require specialized equipment and techniques for soldering, which can add complexity and cost to the production process.
4. Cost: Assess the cost implications of different packages and consider your project budget. Smaller packages generally tend to be more expensive due to their higher manufacturing complexity.
5. Reliability: Evaluate the reliability and durability of the package, especially if your project requires long-term operation or is exposed to harsh environmental conditions. Packages with better mechanical and thermal stability, such as BGA and CSP, offer improved reliability.
By carefully considering these factors and weighing the pros and cons of different SMD component packages, you can make an informed decision that aligns with your project requirements.
If you are looking for the electronic component, VCTELEC is the right electronic part supplier to help you out. Please send us your RFQ&#; to get the best price and prompt delivery time from our existing stock. We are always there to solve your electronic component shortage issue.
For more information, please visit Manually Guided Vehicle.
Comments
Please Join Us to post.
0